Robust embedded memories
Architecture/circuit/device co-optimization for green VLSI systems
Nano-scale emerging devices
3D integration technology
Hai (Helen) Li received B. S. and M. S. degree in Microelectronics from Tsinghua University, Beijing, China and Ph.D. degree from Electrical and Computer Engineering Department of Purdue University, West Lafayette, IN, USA in 2004. She is currently an Assistant Professor at Department of Electrical and Computer Engineering, Polytechnic Institute of NYU, Brooklyn, NY. Dr. Li was with Qualcomm, Intel and Seagate before.
Her research interests include architecture/circuit/device co-optimization for green VLSI systems, emerging embedded memory design, 3D integration technology and design, and design for new devices.